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A neutral earthing resistor is not defined properly by broad assumptions. It is defined by the system. Fault-current level. Voltage. Duration. Thermal duty. Grounding method. Tolerance. Project conditions. If those inputs are unclear, the NER configuration is still only provisional. If they are clear, the specification becomes easier to defend technically. Send system data and move the discussion from assumption to a grounded NER definition.

PCB size can become a critical connectivity constraint long before the design is complete. Learn how board dimensions, materials and the surrounding environment affect antenna behaviour through real design cases and simulation. Register for the webinar

Your lab’s best work should not disappear into old folders, forgotten scripts, or one person’s laptop. 📆 Join our WEBINAR on October 20 to see how DECTRIS D.LAB helps research groups keep data, tools, compute, analyses, decisions, and context connected in one shared platform.

Join our experts for a live product update and Q&A on DECTRIS D.LAB. You will learn how the platform supports connected workflows, reproducible analyses, real-time collaboration, and long-term access to your lab’s scientific knowledge.

We illuminate what matters – meet Elmos at electronica 2026 in Munich. Join us as we showcase our latest semiconductor solutions for automotive #lighting applications and experience our OLED Rear Light demonstrator and our Door Module. We look forward to meeting customers, partners, and industry professionals from around the world. See you in Munich in Hall C3 (Booth 141). #electronica2026 #Elmos #Automotive #Semiconductor #InnovationMatters

We protect what matters – meet Elmos at electronica 2026 in Munich. Join us as we showcase our latest semiconductor solutions for automotive #safety applications and experience our demonstrator for our award-winning Quantum Random Number Generator. We look forward to meeting customers, partners, and industry professionals from around the world. See you in Munich in Hall C3 (Booth 141). #electronica2026 #Elmos #Automotive #Semiconductor #InnovationMatters

%firstname% Connaissez-vous le défi que représente le refroidissement fiable de composants électroniques puissants, malgré un espace d'installation très restreint? C'est précisément là qu'interviennent nos ventilateurs miniatures: 𝐔𝐧𝐞 𝐩𝐮𝐢𝐬𝐬𝐚𝐧𝐜𝐞 𝐝𝐞 𝐫𝐞𝐟𝐫𝐨𝐢𝐝𝐢𝐬𝐬𝐞𝐦𝐞𝐧𝐭 𝐦𝐚𝐱𝐢𝐦𝐚𝐥𝐞 𝐝𝐚𝐧𝐬 𝐮𝐧 𝐞𝐬𝐩𝐚𝐜𝐞 𝐦𝐢𝐧𝐢𝐦𝐚𝐥 Nos ventilateurs miniatures assurent un refroidissement efficace et fiable des composants électroniques de puissance modernes, même dans des espaces d'installation extrêmement restreints. Outre les articles standard du catalogue disponibles immédiatement, nous proposons également des modifications sur mesure selon vos spécifications, et ce dès une seule pièce. 𝐂𝐞𝐥𝐚 𝐯𝐨𝐮𝐬 𝐢𝐧𝐭é𝐫𝐞𝐬𝐬𝐞 ? Alors rendez-vous ici: https://lnkd.in/gvmJ-_7z Découvrez ici nos mini-groupes de ventilation: https://lnkd.in/gDjXDC8q

%firstname% nous aimerions vous présenter brièvement une solution qui pourrait s'avérer particulièrement intéressante pour les composants électroniques compacts. Peut-être cela pourrait-il également vous intéresser pour l'un de vos projets en cours?! 𝐔𝐧 𝐫𝐞𝐟𝐫𝐨𝐢𝐝𝐢𝐬𝐬𝐞𝐦𝐞𝐧𝐭 𝐞𝐟𝐟𝐢𝐜𝐚𝐜𝐞 𝐝𝐢𝐫𝐞𝐜𝐭𝐞𝐦𝐞𝐧𝐭 𝐬𝐮𝐫 𝐥𝐞 𝐜𝐢𝐫𝐜𝐮𝐢𝐭 𝐢𝐦𝐩𝐫𝐢𝐦é: Nos dissipateurs thermiques au niveau de la carte assurent une dissipation thermique fiable dans un format compact. Des matériaux de haute qualité, une fabrication précise et un large choix de géométries permettent une adaptation optimale aux conceptions électroniques modernes. 𝐂𝐞𝐥𝐚 𝐚 é𝐯𝐞𝐢𝐥𝐥é 𝐯𝐨𝐭𝐫𝐞 𝐜𝐮𝐫𝐢𝐨𝐬𝐢𝐭é?! Découvrez nos dissipateurs thermiques ici: https://lnkd.in/g_6vBMPc

Out here, nothing ever relents. 𝗡𝗼𝘁 𝘁𝗵𝗲 𝗰𝗼𝗻𝘀𝘁𝗮𝗻𝘁 𝘃𝗶𝗯𝗿𝗮𝘁𝗶𝗼𝗻. 𝗡𝗼𝘁 𝘁𝗵𝗲 𝗼𝗽𝗲𝗿𝗮𝘁𝗶𝗼𝗻𝘀 𝗿𝘂𝗻𝗻𝗶𝗻𝗴 𝗮𝗿𝗼𝘂𝗻𝗱 𝘁𝗵𝗲 𝗰𝗹𝗼𝗰𝗸. 𝗡𝗼𝘁 𝘁𝗵𝗲 𝗺𝗶𝘀𝘀𝗶𝗼𝗻𝘀 𝘄𝗵𝗲𝗿𝗲 𝗳𝗮𝗶𝗹𝘂𝗿𝗲 𝗶𝘀𝗻'𝘁 𝗮𝗻 𝗼𝗽𝘁𝗶𝗼𝗻. Your hardware can't relent either. That's why HIPER servers are engineered for the front line - because at the forward operating base, nothing is standard. #NothingIsStandard

The mission doesn't pause. Neither does anything else out here. 𝗡𝗼𝘁 𝘁𝗵𝗲 𝗲𝗹𝗲𝗰𝘁𝗿𝗼𝗺𝗮𝗴𝗻𝗲𝘁𝗶𝗰 𝗶𝗻𝘁𝗲𝗿𝗳𝗲𝗿𝗲𝗻𝗰𝗲. 𝗡𝗼𝘁 𝘁𝗵𝗲 𝗿𝗮𝗽𝗶𝗱 𝗮𝗹𝘁𝗶𝘁𝘂𝗱𝗲 𝗰𝗵𝗮𝗻𝗴𝗲𝘀. 𝗡𝗼𝘁 𝘁𝗵𝗲 𝗔𝗜-𝗽𝗼𝘄𝗲𝗿𝗲𝗱 𝗦𝗜𝗚𝗜𝗡𝗧 𝗽𝗿𝗼𝗰𝗲𝘀𝘀𝗶𝗻𝗴 𝗹𝗼𝗮𝗱. Your hardware can't pause either. That's why HIPER servers are engineered for the mission - because inside the autonomous warfare vehicle, nothing is standard. #NothingIsStandard

See how sensors, control systems and TE Connectivity turn onboard measurements into informed action. Explore the Mouser eBook.

Explore how connected electronics help La Roche-Posay Racing Team understand the boat, maintain control and improve performance. Read the eBook.

L'AI è davvero utile quando aiuta le persone a fare meglio il proprio lavoro. Scopri come Cieffe Milano ha scelto Acer TravelMate P6 14 AI per migliorare collaborazione, produttività e creatività. Scarica il case study. #AcerforBusiness #CopilotPCs #Acer #Windows11

L'intelligenza artificiale non sostituisce il saper fare. Lo valorizza. Scopri come Cieffe Milano ha integrato AI e Acer TravelMate P6 14 AI per rendere i processi più veloci, collaborativi e creativi, senza perdere il valore dell'artigianalità. Scarica il case study. #AcerforBusiness #CopilotPCs #Acer #Windows11

From fanless systems to GPU-powered edge servers, Supermicro and Intel® deliver AI solutions for every edge.

Supermicro and Intel® deliver the right AI solution for every edge, from fanless systems to GPU-powered edge servers.

LG Electronics is expanding chiller production for AI data centers across three factories, with a new manufacturing facility in Windsor, Virginia in the United States, and expanded production capacity at its existing plants in Pyeongtaek and Changwon, South Korea. The Virginia facility will span 32,000 square meters, with production scheduled to begin in the first half of 2027. More than half of the world's AI data centers are located in North America, and the new plant will give LG a local production base to serve growing regional demand. LG is also expanding its Korean operations by adopting a conveyor-based production system at both Pyeongtaek and Changwon to improve manufacturing efficiency. Together, the expansion of the three-site expansion represents a total investment of KRW 150 billion. The expanded production will help LG meet growing demand for AI data center cooling and further develop its “Chip-to-Chiller” solution strategy. Chillers provide facility-level cooling, while coolant distribution units (CDUs) and cold plates manage heat close to the chip, giving LG a portfolio that covers the full cooling chain. LG Electronics is also working with LG group affiliates to combine these cooling technologies with cooling management systems, software, power and data center infrastructure, offering customers a more comprehensive approach to AI data center infrastructure. #LGHVACSolutions #HVAC #Chiller #AIDataCenter #DataCenterCooling #ChipToChiller #Manufacturing https://lnkd.in/gNPDDzFP

More computing power means more demanding power delivery. ⚡ From AI servers to data centers, today’s high-performance applications need efficient voltage regulation without adding unnecessary heat or loss. Abracon’s AVR Assembly Inductors combine ultra-low DCR, high current capability, and flexible design options to help engineers meet those demands. Learn more at: https://bit.ly/41oSZxz

When precision matters, timing has to be dependable. Abracon’s AOC97 OCXO helps provide the reliable timing aerospace and defense systems need to stay in sync. 🔗 Explore Abracon’s AOC97 OCXO: https://bit.ly/4jY1qso

AI is changing where workloads run and how data moves across networks. As AI evolves from centralized training to distributed inference and edge deployments, demand for scalable, high-capacity connectivity continues to grow. Join Chuck Girt, CTO of FiberLight, LLC, Sam Lisle, Optical Futures at 1Finity, and Sterling Perrin, Senior Principal Analyst at Omdia for an insightful webinar as they discuss emerging networking trends, optical service delivery models, and the technologies powering the next wave of AI Infrastructure. Register today and reserve your spot: https://lnkd.in/gvZUX-Ar #AI

Our new long-term supply agreement with AIR Control Concepts (AIR) marks an important step in expanding our AI data center cooling business. Under the agreement, LG Electronics will supply advanced cooling solutions for AI data centers across the U.S. and Canada, supporting AI data center projects with more than 5GW of capacity. The scale of this agreement shows that our technology and experience can meet the requirements of hyperscale AI data center projects, and supports our continued growth in North America. We have nearly six decades of experience in HVAC, including highly demanding environments such as nuclear plants and hospitals. We are now applying that experience, together with technologies developed for AI data center cooling, to this fast-growing market. Our goal is to earn the long-term trust of customers and become a key partner in AI data center infrastructure worldwide. We will continue to build partnerships with customers and industry leaders, while strengthening our track record across North America and other key markets. https://lnkd.in/gSTF-jGP #LGHVACSolutions #HVAC #AIDataCenter #Chiller #DataCenterCooling

We had a fantastic turnout for last week's CA DREAMS Technical Seminar with Tiwei Wei, professor and UCLA and associate director of UCLA CHIPS. Revisit the discussion below. Don't miss our seminar this Friday at 12 PM PDT/ 3 PM EDT, with Kelson Chabak, microelectronics research area lead at the Air Force Research Laboratory. Sign up for our seminar series here: https://lnkd.in/gWmcqwSN https://lnkd.in/dhB9XAHm

💾 As AI scales, so does the demand for storage capacity. According to recent analysis in Forbes, AI-driven hard disk drive demand is fundamentally reshaping the storage industry. Organizations are rapidly expanding capacity to handle massive training datasets, model logs, and long-term AI infrastructure needs. The trend is clear: by 2030, AI-driven HDD demand is expected to exceed non-AI demand, driven primarily through higher-capacity drives rather than unit volume alone. (Source: How Has AI Changed Hard Disk Drive Storage Demand?, Thomas Coughlin) This explosive growth depends on precision engineering at every level. From disk clamps and separator plates to flex brackets, shrouds, covers, and voice coil motor yokes, ENNOVI's data storage components deliver the reliability and performance necessary to support HDD systems operating at unprecedented scale. Discover the precision components powering the next generation of AI-ready storage infrastructure: https://lnkd.in/gsTQPVTE/?utm_campaign=IMPACT!Campaigns&utm_source=linkedin&utm_medium=paid&utm_id=806834874&hsa_acc=513160641&hsa_cam=806834874&hsa_grp=887431184&hsa_ad=1541600414&hsa_net=linkedin&hsa_ver=3 #weareENNOVI #DataStorage #ArtificialIntelligence #PrecisionEngineering #HardDriveTechnology #AIInfrastructure #AdvancedManufacturing #TechInnovation

When storage reliability matters, the technology behind the card matters too. ⚙️ The ATP S600Sc Series is built on MLC NAND and combines industrial flash-management features designed to support endurance and data integrity in demanding embedded systems. ➡️ The 4 GB and 8 GB SDHC and microSDHC variants are designed for industrial applications where dependable storage matters over the long term.