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You've perfected the formulation — let us handle the pressure, heat, and vacuum needed to consolidate it. Our toll vacuum hot pressing service transforms your powder recipe into a dense, high-purity finished part using industrial-grade equipment and decades of process expertise, without you having to invest in the capital equipment yourself.

Dissimilar materials, permanently joined. Our vacuum hot press diffusion bonding process combines two distinct materials — such as sputtering targets and backing plates — into a single, void-free part with a strong metallurgical bond. No adhesives, no compromises: just a solid, reliable interface engineered for demanding thin-film applications.

Behind every high-density target is an experienced team working the process, not just the equipment. Our technicians and metallurgists personally oversee loading, pressing, and unloading at every run, catching issues automation alone can miss. That hands-on attention is how we deliver consistent, high-purity results run after run.

Formulate the powder — we'll handle everything else. SCI Engineered Materials takes your material from raw powder through vacuum hot pressing, machining, and bonding, delivering finished sputtering target assemblies ready for production. One partner managing every step means fewer vendors, tighter quality control, and faster time to volume.

Every product that leaves our facility passes rigorous inspection — from raw powder through pressing, machining, and final QC. Our metallurgical team verifies density, purity, and dimensional accuracy at each stage of the vacuum hot pressing process, so you receive a sputtering target that performs consistently, run after run.

High-mobility TFTs start with a cleaner target. SCI's Zinc Tin Oxide sputtering targets deliver indium-free, transparent conductive films with excellent mobility, optical clarity, and thermal stability—built for display and semiconductor roadmaps. Available in custom compositions and geometries.