FormFactor Inc.

In a few days, Alan Liao and I are hosting our webinar, Breaking Down Micro-bump Probing Myths. If you're working with micro-bump test or advanced packaging, we're going to cover many of the practical questions that come up when moving from probe selection to a robust production process. We'll discuss: - Alignment requirements - Probe tip geometry and contact area - Force requirements - Tip size selection - Bump deformation - Pre-reflow versus post-reflow testing - Qualification and process considerations We'll also share real-world application and production examples that help illustrate where some common assumptions about micro-bump probing match manufacturing reality, and where they don't. October 8, 2026 US / Europe: 9:00 AM PDT https://lnkd.in/gMfM9G8q Asia: 9:00 AM CST https://lnkd.in/gBZH-XQj If these are challenges you're working through, I hope you can join us.

How much alignment margin is enough? What probe tip geometry delivers the best contact? How much force is required? How much bump deformation is acceptable? As advanced packaging continues to push toward finer pitches and higher interconnect densities, these seemingly simple questions can have a significant impact on yield, reliability, and overall test performance. Drawing on more than a decade of production-proven micro-bump test deployment experience, FormFactor experts Alan Liao and Jeremy Streifer will examine these challenges using real-world production examples and application data. Join us as we explore practical considerations for selecting probe solutions, managing contact mechanics, controlling process variables, and developing robust micro-bump test strategies for advanced packaging applications. Topics include: • Alignment requirements and contact optimization • Square versus round probe tip selection • Force and tip size considerations • Bump deformation limits • Pre-reflow versus post-reflow testing • Qualification and process considerations 📅 Register today: https://lnkd.in/gQxQjktA #AdvancedPackaging #MicroBump #SemiconductorTest #Chiplets #AI

Over the past couple of weeks, I've shared some thoughts about two things that become increasingly important in micro-bump probing: process control and alignment. They're part of a much bigger conversation. How much alignment margin is really required? How should probe geometry and contact area be evaluated? How much force is necessary? How much bump deformation is acceptable? And how do you determine whether a probing approach that works during development is ready for high-volume manufacturing? These are questions we've encountered through years of micro-bump probing development and production applications. On October 8, Alan Liao and I are going to take a deeper look at them during our webinar, Breaking Down Micro-bump Probing Myths. We'll separate some of the common assumptions around micro-bump probing from what we've observed in actual applications and production environments. US / Europe Registration: https://lnkd.in/gMfM9G8q Asia Registration: https://lnkd.in/gBZH-XQj I hope you’ll join us.

Generative AI is driving rapid innovation in High Bandwidth Memory (HBM) and Custom HBM architectures. As memory bandwidth, I/O density, stack heights, and device complexity continue to increase, semiconductor test requirements are becoming more demanding across thermal, electrical, mechanical, and manufacturing domains. Join FormFactor experts Kevin Tran and Mukesh Selvaraj Ph.D on September 10 for a technical discussion on the trends shaping next-generation HBM and Custom HBM devices, including high-temperature, fine-pitch, and μBump-array test applications. Register today. #HBM #CustomHBM #GenAI #SemiconductorTest #MEMS

HBM is becoming increasingly customized. As AI workloads continue to evolve, HBM architectures are moving beyond traditional memory implementations. Custom PHYs. Custom memory controllers. Logic-rich base dies. Even workload-specific compute functions. These innovations are helping drive higher performance and efficiency, but they also introduce new challenges for semiconductor test. As HBM scales toward higher bandwidth, greater I/O density, and increasing logic integration, test strategies must evolve alongside the devices they are validating. On September 10, FormFactor experts Kevin Tran and Mukesh Selvaraj, Ph.D., will discuss the trends shaping next-generation HBM and Custom HBM technologies and the implications for semiconductor test. Register today: https://lnkd.in/gQxQjktA #HBM #CustomHBM #GenAI #SemiconductorTest #AdvancedPackaging

A few dB of probe loss can make a good die look like a failing one at 224G. That's one of the key topics we'll be discussing during FormFactor's upcoming webinar on July 23. At 224Gbps (and soon 448Gbps), the probe isn't just touching the die, it's part of the signal path. Geometry, force behavior, and electrical path length can all influence measurement results. Alejandro Buritica and Ethan Caughey will discuss how to evaluate wafer-probe performance at these speeds and what questions engineers should ask before accepting high-speed probe claims. If your team is working at 224G or planning ahead for 448G, I think you'll find it worthwhile. https://lnkd.in/gyrctKja