Electronic Specifier Ltd

Did you catch our latest episode? 🎙️ Managing Editor, Paige Hookway spoke with Robert King, Technical Sales and Product Development Manager at Pickering Electronics. His advice to engineers is simple: “How did you arrive at this specification? Could you provide some data behind it?” He also encouraged them to share the details of their application, including voltage, current, switching mode, temperature range, relay spacing, and expected operations. Listen to the full episode: https://lnkd.in/eUbftZw8 This episode is sponsored by Pickering Electronics. #ElectronicSpecifier #Engineering #Tech #PickeringElectronics

Building a Connected Motion Control System from Controller to Terminal Sensors give an automated plant its eyes and ears, but motion and control supplies the heart and mind. On today’s production floor, what you notice is movement with no hand on the lever; pallets crossing the length of a warehouse, parts turned and positioned at each station, fluids pushed through long runs of pipe. But behind what you see is an intelligent chain of hardware that decides, commands, switches, and drives every movement. Continue reading the full article: https://lnkd.in/eGKfHseJ #ElectronicSpecifier #DigiKey #Electronics #Engineering #MotionControl #Tech

Whitepaper: Infineon Technologies, in association with EBV Elektronik This whitepaper from Infineon, presented with EBV Elektronik, explores where USB 3.x fits alongside MIPI CSI-2, GMSL and 10 Gbit Ethernet, and why its combination of speed, market maturity and cost-effectiveness makes it a viable option for next-generation embedded designs. The paper also looks in detail at Infineon’s EZ-USB FX10 peripheral controller, including its architecture, autonomous data movement and security features, and how it supports compliance with regulations such as the EU Cyber Resilience Act. Complete the short form to access the whitepaper 👉 https://lnkd.in/e_5aYU7n #ElectronicSpecifier #Whitepaper #Tech #Embedded #Ethernet

The invisible ceiling: why cooling is limiting compute growth 🧊 As computing demands accelerate across AI, HPC, defence, telecommunications, and other high-performance applications, organisations are adding increasingly powerful processors, GPUs, FPGAs, and accelerators. But there is a growing challenge: the ability to remove the heat generated by that computing capacity. In many systems, electrical power, rack space, and floor space may still be available. Thermal capacity, however, is becoming the limiting factor. Read the full article by nVent SCHROFF here: https://bit.ly/3WeA7SR #ThermalManagement #DataCentres #HighPerformanceComputing #AI #LiquidCooling #ElectronicsCooling #nVentSCHROFF

🎙️ NEW EPISODE LIVE FRIDAY AT 9 AM! Can you really trust the numbers on a datasheet? When it comes to reed relays, the most impressive specification doesn't always mean the best performance. We caught up with Robert King from Pickering Electronics to discuss why there's more to component selection than meets the eye, and why testing conditions matter. 🎧 Find out more in Friday's episode of Electronic Specifier Insights! 🔗 Catch up on our latest episodes here: https://lnkd.in/erQzVA5p This episode is sponsored by Pickering Electronics. #ElectronicSpecifier #SpecifierInsights #ReedRelays #ElectronicsEngineering #Podcast

🌡️ Could cooling be the biggest barrier to the next generation of computing? As demand for AI and high-performance computing continues to grow, more powerful processors are generating greater amounts of heat. But even when power and rack space are available, cooling capacity can limit further growth. From optimising airflow to introducing liquid-assisted cooling, smarter thermal management can help organisations unlock more computing capacity without increasing their rack footprint. Discover how nVent SCHROFF’s thermal solutions, including the Easy Swap LFT and 4U LHX, are helping address rising cooling demands and create valuable thermal headroom. 🔗 Read the full article to explore why cooling is becoming a key factor in future computing performance: https://lnkd.in/eiZCBj7X #ThermalManagement #DataCentres #HighPerformanceComputing #AI #LiquidCooling #ElectronicsCooling #nVentSCHROFF