Compal

We build AI servers, so we see AI’s carbon footprint up close. Can the same technology that burns the energy also help us cut the carbon? Climate Week NYC brought the same challenge back into focus: “the solutions exist and the visions exist, and we need to collectively keep the pressure on in terms of accountability.” The harder work is turning ambition into action, and that starts with closing the gap between what companies say and what they can show. At Compal, we begin with data transparency as the basis for accountability. Through the Compal Cloud for Sustainability, we bring emissions, energy, water, and waste data together across our operations, and keep it current. Programs such as CDP disclosure, ISO 14064 training, and our ONE+N Electronics Supply Chain Net-Zero Acceleration Program extend that transparency to our supply chain. Building on this foundation, Compal is in the early stages of implementing internal carbon pricing (ICP). Going forward, we plan to gradually integrate carbon pricing into investment and capital-expenditure decisions and expand its application across our operations. Separately, senior leaders carry climate-related performance goals. Together, these efforts will help embed climate considerations into everyday business decisions. We have the data and the platform today, and carbon pricing is starting to shape our decisions. AI is what we’re layering on next — to turn live data into sharper carbon decisions. That’s where the handprint starts to show against the footprint. #AI #Sustainability #DataTransparency #InternalCarbonPricing #Compal #ClimateWeekNYC

Power, compute, cooling, and controls must work as one system to support the next generation of high-density AI infrastructure. Compal Electronics and Exascale Labs have signed a Letter of Intent to jointly develop a U.S.-based, data-center-grade validation platform for next-generation GPU systems. Built on a native 800 VDC architecture using solid-state transformer (SST) technology, the platform is designed to test GPU computing systems within a fully integrated AI data center environment. The platform will combine Compal’s production-grade GPU server platforms and liquid cooling systems with Exascale’s Modular Data Center and SST power architecture—enabling power, compute, cooling, and controls to be engineered and validated together before deployment. Compal is also expected to provide the U.S. project site. For Compal, this collaboration brings our GPU servers and cooling systems into the development process from the outset. By validating the complete infrastructure under real operating conditions, the project aims to build experience and data toward future volume production and industry certification—and develop a repeatable architecture capable of supporting future high-density AI deployments at scale. As AI infrastructure evolves, system-level integration will be essential. We look forward to working with Exascale Labs to advance the validation of next-generation GPU infrastructure. Learn more about the collaboration and our approach to next-generation AI infrastructure on the Compal website: https://lihi2.me/uE4w4 #Compal #AIInfrastructure #DataCenter #GPU #800VDC #LiquidCooling

When a disaster strikes a region with no cell towers, or a cargo ship crosses open ocean beyond any network's reach, how does connectivity survive? At #Compal, we recognize that traditional terrestrial networks leave critical gaps. For industries operating at the extreme edge—from maritime transport and smart agriculture to emergency disaster response—continuous data flow is not just an operational goal; it is a lifeline. To bridge these gaps, we have engineered a comprehensive, end-to-end Non-Terrestrial Network (NTN) ecosystem that spans from edge devices to advanced ground validation and space-grade payloads: 🔷 APAL Hestia NTN IoT Dongle (Now Launched in the U.S. via Amazon): Supporting 3GPP Release 17 NTN GEO satellite two-way communication. Featuring ultra-low power consumption, plug-and-play Modbus RS485 integration, and hybrid network compatibility (including LoRaWAN and BLE), Hestia ensures your edge devices stay connected in the most demanding environments. 🔷 Validated Ground Equipment Maturity: Through our strategic collaboration with the Industrial Technology Research Institute (ITRI), we have successfully validated our ground-to-air communication architecture. In real-world field testing, our ground equipment maintained over a 99% connection success rate with sub-hundred-millisecond latency under complex electromagnetic conditions, proving our systems are production-ready for long-distance surveillance and disaster recovery. 🔷 Expanding into Space-Grade Payloads: As a key contributor to the Taiwan Space Agency (TASA) "Pathfinder" national team, we are actively developing communication payload RF modules. Our multi-carrier array antenna technology is paving the way for next-generation 6G space communication. From the ocean floor to low Earth orbit, our integrated hardware, ground verification, and strategic ecosystem collaborations are transforming remote connectivity from a complex engineering challenge into an accessible, scalable business reality. Are you ready to build a more resilient, always-connected infrastructure? Reach out to our team to explore how we can customize our NTN solutions for your global operations: 🔗 https://lihi2.me/UmrQq #Compal #NTN #SatelliteIoT #NonTerrestrialNetwork #EdgeConnectivity #IoT #GlobalCoverage #SmartConnectivity

What happens when generative AI workloads scale past the limits of legacy data center power and cooling grids? As hyperscalers and Cloud Service Providers (CSPs) across North America race to deploy massive GPU clusters, they encounter a critical bottleneck: the soaring Total Cost of Ownership (TCO) driven by power density and thermal overhead. Raw compute power is only half the equation—real scalability requires hardware-level systems integration and thermal optimization. At #Compal, we are bridging this gap through our strategic collaboration with GMI Cloud, delivering highly optimized, production-ready GPU server solutions directly into North American cloud infrastructures. By combining GMI Cloud's advanced orchestration layer with Compal’s decades of hardware engineering expertise, we are enabling enterprises to run large-scale AI inference workloads with unmatched efficiency and reliability: 🔷 NVIDIA MGX™ Modular Architecture Our next-generation platforms leverage modular NVIDIA MGX™ designs, allowing rapid integration of NVIDIA HGX™ GPUs with PCIe Gen 5 connectivity. This modularity dramatically shortens deployment times for hyperscale operators. 🔷 Advanced Liquid & Air Thermal Dynamics To combat the heat generation of intensive AI processing, our server platforms feature advanced direct-to-chip (D2C) liquid cooling compatibility and optimized air-flow channels. This reduces PUE (Power Usage Effectiveness) and lowers ongoing operational overhead. 🔷 Ecosystem-Validated Reliability Every platform undergoes rigorous, end-to-end system integration and production validation at our facilities. Our global supply chain ensures that these complex systems arrive on-site fully integrated, validated, and ready to scale. As the industry pivots from experimental AI training to continuous, high-throughput inference deployment, Compal remains dedicated to engineering the high-performance physical foundation of the digital future. Are you ready to optimize your cloud architecture for next-generation AI workloads? Let’s connect. Contact our infrastructure experts today, or explore our newly upgraded server product line: https://lihi1.me/kAPsj #Compal #GMICloud #AIInfrastructure #AIInference #DataCenter #GPUClusters #HPC #EcosystemCollaboration #ProductionReady

How much engineering bandwidth does your organization divert to the manual monitoring of product validation cycles? In the critical New Product Introduction (NPI) phase, quality assurance remains a highly complex and dynamic engineering task. With diverse customer specifications, varying operating system environments, and customized hardware configurations, traditional automated scripts often require constant human monitoring to manage unexpected pop-ups, environment variations, and Excel report compilation. This intensive reliance on manual oversight creates systemic bottlenecks right before mass production. At #Compal, we have achieved a critical milestone in resolving this operational pain point. Our newly engineered solution, "AI Agent for PC Test Automation," was recently awarded the Silver Medal at the Economic Affairs' AI Innovation Awards. Instead of relying on rigid scripts, our AI Agent understands requirements, interacts with dynamic user interfaces, and autonomously resolves exceptions—performing three core tasks traditionally handled by engineers. 🔷 Requirement Interpretation: Processing un-structured product specifications, PDFs, and Excel data via large language models to analyze test parameters automatically. 🔷 Autonomous GUI Interaction : Utilizing computer vision to interpret screen changes, autonomously managing mouse and keyboard controls to navigate dynamic validation environments. 🔷 Intelligent Failure Recovery: Automatically validating test logs, initiating re-runs upon isolated script failures, and escalating data only when human analytical input is required. The AI Agent platform has been successfully deployed in production, reducing manual monitoring time from an average of 150 hours to just one hour while enabling engineers to focus on higher-value analysis and innovation. Designed with enterprise security and deployment flexibility in mind, the platform supports on-premises, cloud, and hybrid environments without relying on centralized AI infrastructure or dedicated GPU clusters. It is optimized for deployment on AI PCs, industrial edge devices, and dedicated AI appliances, enabling enterprises to maintain data sovereignty while scaling AI across engineering and manufacturing operations. As part of our comprehensive digital transformation led by our President Anthony Peter Bonadero, we are actively expanding this solution toward broader commercialization and manufacturing scale. True technological maturity is defined by how effectively we empower human talent to focus on innovation. Let’s build a more efficient, automated future for hardware validation, together. Explore our enterprise infrastructure solutions and digital transformation roadmap: https://lihi2.me/yBBbf #Compal #AIAgent #TestAutomation #QualityAssurance #SmartManufacturing #DigitalTransformation #HardwareEngineering #NPI

How do global technology brands scale circularity without the historical trade-offs in hardware reliability? The paradigm of eco-conscious development has evolved from high-level corporate declarations to rigorous, data-driven material engineering. At #Compal, we recognize that true net-zero leadership starts at the material and product level. Through our Sustainable Material Lab (SML), we transform overlooked industrial byproducts and agricultural waste streams into high-performance, mass-production-ready materials — turning carbon reduction into circular material stories people can see, touch, and experience through everyday technology. Each material reflects a unique path toward circular innovation — from AI-era wafer manufacturing waste to agricultural residues and cross-industry recycled resources: 🔷 AI DNA — rSilPlas The AI era relies on advanced wafer manufacturing. rSilPlas gives the waste slurry from this process a second life by transforming it into a high-performance recycled plastic material. This creates a new possibility for future devices: AI DNA inside the system, and outside in the product itself. 🔷 Nature DNA — BioHusk By protecting buckwheat husk fibers with proprietary thermal-stability coatings during compounding, we extend the life of nature into high-tech products. BioHusk uses protected buckwheat husk fibers as a lower-carbon alternative to mica powder, reducing filler-related emissions by up to 87% compared with mica while meeting stringent flame-retardant standards. 🔷 Cross-Industry Circularity — ReTyre & WindshieldFlex By repurposing end-of-life tire carbon black and salvaged windshield safety layers, we extend circularity beyond the electronics industry into durable materials for education and enterprise computing hardware. This demonstrates how cross-industry waste transformation can create a broader standard for responsible material reuse. From material sourcing and formulation to validation, product integration, and scalable production, SML empowers Compal and its customers to turn circular material concepts into real product differentiation — making sustainability a visible, tangible, and meaningful part of next-generation technology products. Discover our material portfolio and sustainable engineering roadmap: https://lihi2.me/z73pj #Compal #SustainableMaterialLab #CircularEconomy #ESGLeadership #MaterialInnovation #GreenManufacturing #NetZero