Atotech an MKS Brand

How can process teams balance production queue time with bonding reactivity? 👉Download our whitepaper to explore technical findings on metastable fine-grain copper, ambient grain stability, thermally activated recrystallization, and their relevance for wafer-to-wafer and die-to-wafer hybrid bonding.

What defines the future of decorative chrome? This white paper explores the technologies, finishes, and performance innovations shaping the next generation of decorative chrome plating. In this white paper, you can explore: ✔ The science behind modern trivalent chromium processes ✔Color versatility and finish customization options ✔Corrosion resistance and multilayer coating systems

Discover how the CMA Closed Loop System helps electroplaters reduce waste, lower energy consumption, improve current efficiency, and move closer to Zero Liquid Discharge operations. In the white paper, learn how Compact Membrane Anode (CMA) technology: ✔ Prevents harmful anodic byproducts ✔ Improves plating efficiency and productivity ✔ Reduces wastewater and sludge generation ✔ Advances sustainability goals without compromising performance

Our new LinkedIn article is live. What copper properties will be required to move hybrid bonding from technical feasibility to high-yield production? Hybrid copper bonding can support the fine-pitch interconnections required for AI, HPC and chiplet architectures. However, forming a void-free, low-resistance Cu–Cu interface at a reduced thermal budget depends strongly on copper microstructure. Read the article to explore why queue-time stability, grain growth, feature geometry and seed-layer texture matter. If the subject is relevant to your work, download the complete white paper for detailed microstructural results and integration considerations. 📥 Read the article to explore the potential of wet metallization for glass substrates. If the topic is relevant to your work, download the full white paper for detailed process insights, performance results and application examples #HybridBonding #AdvancedPackaging #CopperPlating #MKSAtotech

Advanced pattern plating technologies such as SAP and (a)mSAP require precise panel handling, particularly as lines and spaces become finer and dry-film structures more sensitive. Our vPlate® ICS is a fully automated vertical continuous copper plating system designed for touchless PCB panel transportation. It supports a wide range of board and substrate technologies, from standard multilayer and HDI to advanced HDI, rigid-flex, and package substrates, with lines and spaces down to 8/8 μm. The equipment can be combined with the InPro® process series for through-hole and blind microvia filling, InPro® VLF and InPro® Flex 2 for conformal plating, and Cuprapulse® IN with vPlate® ICS pulse plating capability for HAR and HHD applications. This integrated combination of equipment, software, and process chemistry helps manufacturers address complex plating requirements while reducing contact with sensitive panel surfaces. Explore how MKS’ Atotech can help you develop an integrated plating approach for your next advanced PCB or IC substrate application. Speak with our specialists today. For more information, please visit: https://lnkd.in/ePKTh8V4 #MKSAtotech #vPlate #AdvancedPackaging #ICSubstrate #Electroplating

As the plating on plastics industry prepares for a Cr(VI)-free future, manufacturers face a critical question: How can this transition be achieved without compromising production performance? SAXONIA Galvanik has already taken the next step. Read the customer success story to discover how the company successfully implemented Covertron® 600 and established a Cr(VI)-free mass production process. Download your copy now!