AT&S

Can advanced packaging power Europe’s future in space? As space systems become more powerful, connected, and AI-enabled, advanced packaging technologies such as IC substrates and organic interposers are becoming essential. Through the EU-funded SUPERPACS initiative, AT&S is contributing its expertise to help build resilient European capabilities for high-performance space electronics. Read this Tech Connect: Expert Edition from Dr. Vivian Suru John-Denk (PhD, BB, PMP) to discover why advanced packaging is critical to Europe’s technological sovereignty, and the future of space innovation. SUPERPACS EU project #ATS #EUSpaceResearch #EUSpace #EuropeanUnion #ICSubstrates #OrganicInterposer #FutureSpace

See you at Electronica in Munich! 👋

Bringing new technologies to market faster requires more than speed. It takes the right combination of design know-how, advanced PCB technologies and reliable manufacturing. AT&S supports customers from development through industrialization, helping to optimize designs early, reduce iterations and prepare solutions for efficient scaling. With engineering expertise and a global manufacturing network, AT&S helps turn innovative ideas into market-ready technologies faster. #ATandS #TimeToMarket #PCB #Engineering #Innovation #Electronics #Manufacturing #oneATS

Speed in electronics development is not just about moving faster. It’s about making the right decisions earlier. By combining design expertise, advanced PCB technologies and global manufacturing capabilities, AT&S helps turn complex product requirements into production-ready solutions. Efficiently and at scale. From early design and optimization to industrialization and manufacturing, close integration across the development process helps reduce complexity, avoid costly redesign loops and accelerate the path from idea to market. Because when innovation moves fast, your technology partner should too. #ATandS #TimeToMarket #PCB #Electronics #Innovation #Engineering #AdvancedTechnologies #oneATS

🛰️ As satellite networks expand, the electronics behind them must deliver more data in smaller, lighter, and more resilient systems. Our latest article explores how LEO, MEO, and GEO satellites differ and why PCB design is critical for signal integrity, thermal management, miniaturization, and long-term reliability in space. Read to discover the technology behind today’s growing satellite infrastructure. #Satellite #SpaceElectronics #PCB #Aerospace #Engineering

Advanced PCB solutions for reliable satellite communication :satellite: Higher frequencies, increasing bandwidth demands and extreme operating conditions are pushing satellite communication systems to new levels of complexity. AT&S provides advanced PCB technologies and engineering expertise to help aerospace and satellite innovators meet these challenges – from signal integrity and thermal management to miniaturization and manufacturability. With technologies such as HDI, ECP®, mSAP and Z-Interconnect, combined with low-loss materials and RF-optimized designs, AT&S enables high-performance communication solutions for demanding space applications. Backed by European manufacturing capabilities, simulation-driven development and aerospace-certified quality, we help our customers reduce development risk and accelerate their time-to-orbit. Discover how AT&S is enabling the next generation of satellite communication. #oneATS #Aerospace #SatelliteCommunication #SpaceTechnology #PCB #RFElectronics #Engineering #Innovation