On air · 1 of 3 networks
ASE Global
- aseglobal.com
- Hardware & Electronics
- TW
- 6,535 employees
ASE Global’s ads on LinkedIn, Meta and Google, recorded by adsrunning. Browse the latest here for free. Sign up free to see all 21. Watch ASE Global with Starter to get each new one in your feed.
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| Network | Status | Live ads | Nov 2025LinkedIn activity · 52 weeksOct 2026 | Checked | Next step |
|---|---|---|---|---|---|
| Running | 19 | Checked 30 Oct 2026 | See all 21 ads → | ||
| Meta | Not checked | — | |||
| None recorded | 0 | No ads found on the Google Ads Transparency Center | Checked 5 Oct 2026 | Collect them with the API → |
ASE Global has 19 live LinkedIn ads. We recorded no Google ads on 5 Oct 2026.
Latest ads
- LINKEDIN · JOBSince 4 May 2026
- LINKEDIN · VIDEORecorded 8 Sept 2026
From computing to power delivery, ASE redefines what’s possible. VIPack™ integrates multiple chips into one advanced package to boost performance, efficiency, and speed for AI, HPC, and next-gen electronics. Complementing this, powerSiP™ introduces vertically integrated VRM solutions that deliver faster, more efficient power directly beneath the chip—cutting power loss by half and enabling compact, high-density designs. Together, VIPack™ and powerSiP™ power the future of heterogeneous integration. 🚀 Follow ASE to explore more innovations shaping tomorrow.
- LINKEDIN · VIDEORecorded 8 Sept 2026
The challenge is big — but so is our commitment. At ASE, we’re transforming semiconductor packaging with bold, low-carbon solutions: 🔹 Smarter factories with AI & digital twin tech 🔹 Thermal process energy optimization 🔹 Renewable energy powering our future 🔹 Co-developing low-carbon solutions with suppliers 👉 Follow ASE for insights on sustainability and semiconductor innovation
- LINKEDIN · VIDEORecorded 8 Sept 2026
ASE FOCoS-Bridge with Through-Silicon Via (TSV) reduces power loss by 3x for next-generation AI and HPC Applications. Enhanced I/O density and thermal performance significantly strengthen the VIPack™ platform, meeting the demands of next-generation systems.
- LINKEDIN · VIDEORecorded 8 Sept 2026
Silicon photonics is poised to revolutionize AI infrastructure by shifting from copper to light-based data transmission. It's a game changer for next-gen data centers—boosting compute power while reducing energy use. Co-packaged optics (CPO) is an advanced packaging technology that integrates optical components to optimize performance, scalability, and latency. ASE's CPO enhances energy efficiency by mounting multiple optical engines (OE) directly onto a substrate, enabling <5pJ/bit power consumption and significantly improving bandwidth.
- LINKEDIN · FOLLOWRecorded 7 Oct 2026
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