ADLINK Technology

🚀 Just released: COM-HPC Carrier Board Design Guide, Revision 2.3 (COM-HPC Spec 1.3) If youre designing a carrier board around COM-HPC modules, this update is worth grabbing. It reflects the latest COM-HPC 1.3 specification updates and gives your engineering team the reference they need to design faster, avoid costly layout revisions, and stay aligned with the current standard from day one. Whether youre building for industrial automation, edge AI, or physical AI applications, getting your carrier board design right the first time means fewer iterations and a faster path from prototype to production. 📥 Download the latest revision and make sure your next design starts on the right foundation. 👉 https://lnkd.in/gNg6MVTu

When failure is not an option, your embedded computing architecture needs to deliver uncompromised compute density in the harshest environments. Introducing the ADLINK COM-HPC-mPTL computer-on-module: Next-generation COM-HPC Mini type module engineered for defense electronics and ruggedized computing. Built on the latest COM-HPC R1.3 standard and powered by Intel® Core™ Ultra Series 3 processors, this ultra-compact 95mm x 70mm module brings server-grade architecture and real-time AI processing straight to the tactical edge. Why Defense Electronics Manufacturers Choose the COM-HPC-mPTL: 🔹 Mini Form Factor (95mm x 70mm): Maximize SWaP-C (Size, Weight, Power, and Cost) efficiency in space-constrained avionics, naval systems, and unmanned vehicles. 🔹 Extreme Durability: Designed to withstand high shock, continuous vibration, and extreme operating temperatures. 🔹 Next-Gen Edge AI Acceleration: Built-in NPU and integrated graphics deliver real-time image recognition, sensor fusion, and multi-stream radar signal processing. 🔹 High-Speed I/O & Open Standards: Standardized COM-HPC R1.3 interface ensures future-proof modularity, long-life availability, and strict revision control. Engineered to protect your design investments and mission-critical operations.

Time-to-market and scalability are two of the biggest hurdles facing drone manufacturers today, especially when talent often comes from adjacent industries rather than traditional aerospace backgrounds. ADLINK's new article breaks down how Computer-on-Module (COM) architectures—built on open standards like SMARC, OSM, and COM-HPC Mini—help drone manufacturers: 1️⃣ offload design complexity, 2️⃣ cut development costs, 3️⃣ and accelerate launch timelines while still hitting demanding AI, power, and thermal requirements. Inside, you'll find a practical directory matching AI models (YOLOv8, obstacle avoidance, SLAM, and more) to the right ADLINK COM module, OS, and framework, plus real-world examples like the LEC-RB5N and OSM-MTK510 in action. Read the full article to see how the right compute foundation can give your drone platform a competitive edge. 👉 Download the full white paper here: [Insert Link] #HardwareEngineering #COMHPC #SMARC #OSM #EmbeddedDesign #ProductDesign #UAV #Drones

Hallo %FIRSTNAME%, ich bin Helge Nieß, Key Account Manager bei ADLINK Technology. Ich unterstütze Bahnunternehmen und Systemintegratoren bei der Auswahl zuverlässiger Edge-Computing-Plattformen für Onboard-, Trackside- und Fahrgastinformationssysteme. Auf der InnoTrans 2026 präsentiert ADLINK KI-Plattformen für Bahnanwendungen, 5G-Train-to-Ground-Gateways, CompactPCI-Serial-Systeme und Lösungen für die Fahrgastinformation – entwickelt für anspruchsvolle Einsatzbedingungen und lange Produktlebenszyklen. In einem persönlichen Gespräch können Sie Ihre Anforderungen direkt mit unseren Bahnspezialisten besprechen, geeignete Plattformarchitekturen vergleichen und mögliche Integrations- und Lebenszyklusrisiken frühzeitig erkennen. Wenn dies für ein aktuelles oder geplantes Projekt relevant ist, freue ich mich auf ein persönliches Gespräch auf der InnoTrans. 📍 Halle 4.1 | Stand 672

Hallo %FIRSTNAME%, ich bin Helge Nieß, Key Account Manager bei ADLINK Technology. Ich unterstütze Bahnbetreiber, Fahrzeughersteller und Systemintegratoren bei der Auswahl zuverlässiger Edge-Computing-Plattformen für Bahnsysteme mit langen Lebenszyklen. In den Bahnprojekten, die wir begleiten, zeigt sich immer wieder dieselbe Herausforderung: KI und Echtzeit-Konnektivität in bestehende Systeme zu integrieren, ohne den Integrationsaufwand oder die langfristigen Betriebsrisiken zu erhöhen. Auf der InnoTrans 2026 präsentiert ADLINK unter anderem: KI-Plattformen für Bahn-Anwendungen 5G Train-to-Ground Gateways Lösungen für Fahrgastinformationssysteme Wenn diese Themen für Ihre aktuellen oder zukünftigen Projekte relevant sind, freue ich mich darauf, Sie auf der Messe persönlich kennenzulernen und mögliche Lösungsansätze zu besprechen. 📍 Halle 4.1 | Stand 672

Hi %FIRSTNAME%, I’m Henrik Petersen, Key Account Manager at ADLINK Technology. I work with railway customers and system integrators to support the deployment of reliable, long-lifecycle edge computing solutions. As rail operations become more connected and intelligent, organizations face a broader challenge: introducing AI and real-time connectivity without increasing deployment risk, operational complexity, or lifecycle uncertainty. At InnoTrans 2026, ADLINK will present railway AI platforms, 5G train-to-ground gateways, and passenger information solutions designed to support reliable, scalable rail operations. If these priorities align with your current or upcoming initiatives, I’d welcome a brief discussion at Messe Berlin to explore how ADLINK could support your deployment strategy. 📍 Drop by our booth at Hall 4.1, Booth 672