TA Instruments

From flexible circuits to pressure-sensitive adhesives, electronics materials require targeted testing strategies. This free guide breaks down key characterization methods by application, giving R&D engineers, electronics designers, and lab managers a clear framework for selecting, validating, and qualifying materials with confidence. Download the free guide.

Thermal interface materials and adhesives that perform in the lab can still fail under real operating conditions. Learn how material characterization, from thermal stability testing to mechanical behavior under elevated temperatures, helps electronics engineers confirm performance margins before products reach the field. Download the free guide.

Your electronics materials face mechanical strain, thermal cycling, and adhesion demands across their entire service life. This guide covers the characterization techniques, from DMA to rheology, that help R&D engineers and lab managers validate their materials under conditions that reflect actual use. Download the free guide.

Failure analysis after the fact is costly. Characterizing material behavior before assembly including thermal stability margins, mechanical integrity under strain, adhesion durability under humidity and temperature cycling, gives you the data to catch potential failures at the material selection stage. This ebook outlines practical testing approaches for electronics engineers working with adhesives, TIMs, and flexible substrates. Download the free guide.

Failure analysis after the fact is costly. Characterizing material behavior before assembly including thermal stability margins, mechanical integrity under strain, adhesion durability under humidity and temperature cycling, gives you the data to catch potential failures at the material selection stage. This ebook outlines practical testing approaches for electronics engineers working with adhesives, TIMs, and flexible substrates. Download the free guide.

The board warped. Find out why live on August 26. By the time a substrate problem reaches assembly, the useful data is already behind you. Materials metrology moves the answer earlier: where the resin cures, where the polymer transitions, where degradation begins, and how much the material expands getting there. One live hour, four techniques, real case studies. Wednesday, August 26, 11 AM EDT. Free to attend.