On air · 1 of 3 networks
Lam Research
- lamresearch.com
- US
- 18,474 employees
Lam Research’s ads on LinkedIn, Meta and Google, recorded by adsrunning. Browse the latest here for free. Sign up free to see all 52. Watch Lam Research with Starter to get each new one in your feed.
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| Network | Status | Live ads | Nov 2025LinkedIn activity · 52 weeksOct 2026 | Checked | Next step |
|---|---|---|---|---|---|
| Running | 49 | Checked 29 Oct 2026 | See all 52 ads → | ||
| Meta | None recorded | 0 | No active ads recorded on the Meta Ad Library | Checked 20 Oct 2026 | Collect them with the API → |
| Recently | 8 | Ads on the Google Ads Transparency Center | Checked 2 Oct 2026 | Collect them with the API → |
Lam Research has 49 live LinkedIn ads. Its Facebook page had no active ads on 20 Oct 2026, and we recorded 8 Google ads on 2 Oct 2026.
Latest ads
- LINKEDIN · FOLLOWSince 31 Jul 2025
Get the latest jobs and industry news
- LINKEDIN · JOBSince 18 Dec 2023
- LINKEDIN · IMAGERecorded 24 Sept 2026
Our teams are driving semiconductor breakthroughs in Phoenix - and across the globe. Check out our panel at SEMICON West to learn more. https://bit.ly/4nw32dR
- LINKEDIN · VIDEORecorded 24 Sept 2026
VECTOR® TEOS 3D, the newest member of our advanced packaging portfolio, unlocks the future of chip technology. By reducing cracks and voids in thick dielectric gapfill films and tackling high-bow wafers, TEOS 3D addresses key production challenges in advanced packaging for 3D chips powering AI and high-performance computing. Watch the video.
- LINKEDIN · VIDEORecorded 24 Sept 2026
As AI continues to evolve, advanced packaging is key. By integrating multiple chips into a single package, this technology plays a critical role in the development of faster, more efficient microchips. Learn how our advanced packaging tools and techniques accelerate the evolution of chip design. https://bit.ly/42GBLwW
- LINKEDIN · VIDEORecorded 24 Sept 2026
Advanced packaging is a complex sequence of precision steps. Our technologies — like VECTOR® TEOS 3D and SABRE® 3D — work together to overcome challenges in TSV etching, bonding, dicing, and thin-film deposition, enabling stronger, more reliable devices for the next generation of computing. Watch how it all comes together in our full video.
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